chip package造句
例句與造句
- csp causes the revolution of memory chip package technology
引發(fā)內(nèi)存封裝技術(shù)的革命 - the development of memory chip package technology
內(nèi)存芯片封裝技術(shù)的發(fā)展 - the development of chip package technology
芯片封裝技術(shù)的發(fā)展演變 - development of cpu chip package technology
芯片封裝技術(shù)的發(fā)展演變 - the development of cpu chip package technology
芯片封裝技術(shù)的發(fā)展 - It's difficult to find chip package in a sentence. 用chip package造句挺難的
- introduction of the chip package technology
芯片封裝技術(shù)介紹 - the advanced chip package technology
先進(jìn)芯片封裝技術(shù) - analysis and suppression of simultaneous switching noise in high-speed chip package
高速芯片封裝結(jié)構(gòu)的同步開(kāi)關(guān)噪聲分析及抑制 - new high speed and high precision planar positioning mechanism for chip packaging
面向芯片封裝的新型高速高精度平面定位機(jī)構(gòu)研究 - the report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now
目前，測(cè)定實(shí)際倒裝焊封裝界面分層傳播速率報(bào)道尚少見(jiàn)。 - the reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations
本文針對(duì)倒裝焊封裝可靠性問(wèn)題進(jìn)行了實(shí)驗(yàn)和數(shù)值模擬兩方面的研究。 - lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
完成某集成電路封裝（叩焊芯片）內(nèi)部實(shí)際的電氣連接的焊料中的鉛。 - lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
集成電路倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛。 - plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation
等離子體400和660系列是低壓微波等離子體應(yīng)用于提高模具粘合，引線的焊接，特別是清洗高級(jí)的芯片封裝。 - to our knowledge, for real flip chip packaging under the thermal loading, the paris equation obtained from experiment da / dn and simulation g is firstly reported here, and will be useful practically
本文在熱循環(huán)加載條件下對(duì)實(shí)際倒裝焊封裝給出實(shí)驗(yàn)da/dn和模擬g關(guān)系的paris方程，屬首次報(bào)導(dǎo)。
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